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Sts pecvd, multiplex in great shape


This Multiplex System is a manually loaded load-lock batch plasma Deposition system, designed for Research and Development and small scale production. The wafer platen can accommodatea variety of substrate sizes from 75MM up to 200MM.
The system is designed for maximum process flexibility and reproducibility. A combined heated electrode and process gas showerhead arrangement which is located in the upper assembly of the process chamber ensures uniform process gas distribution. The lower half of the process chamber comprises of a temperature stabilized heated lower\electrode platen designed to ensure that plasma is confined to the required area.
The system has been designed to the highest vacuum engineering standards with the number of components kept to a miminimum, with paticular consideration given to the elimination of virtual leaks.the results in a very stable chamber enviroment leading to processes of the highest quality.
The aluminium load-lock has a transparent hinged lid which allows easy access for loading/unloading of the wafer carrier.
After loading of the wafer into the load-lock, the system automaticlly carries out pumpdown,leak check and transfer of the wafer into the process chamber via the carriage assembly, after which the process will be started.
System Control is via an Industry Standard Personal computer which provides fully automatic and user friendly operation.A color monitor displays process informationand mimic displays, allowing the system to be easily operated and continuously monitored.Process recipes may be downloaded to a hard or floppy disk allowing secure storage of unlimited numbers of recipes.
Requires:3 phase 200 volt at 40 Amps per phase at 60 hz, CDA at between 80 and 100 PSI, flow at least 10 Liter per minute, Cooling water at least 7 Liter per minute and less than 100 PSI.
Serial Number is 03041 Version 95B.
Thank you for reading this and I will do my best to answer any questions.



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