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G & n mps t-500 backside wafer grinder


One spindle - One Operation. The G&N-Patent for maximum Precision High stock removal rates with minimum damage to the crystalline structure of highly sensitive and valuable materials. The maximum wheel contact zone is utilized to achieve high stock removal rates and the back of the wafer is ground in one operation. The double-elevator mechanism with a storage capacity of 75 wafers in three cassettes ensures a continuous-flow operating cycle in the MPS T 500. The Grinding Cycle- Minimum damage depth and maximum stock removal. While the table rotates slowly, the wafer is finish ground by an additional outer grinding ring which projects down slightly beyond the face of the main grinding wheel. This operation provides the finishing grind to produce the desired thickness, surface finish and damage depth. The grinding process can be optimally matched to the wafer material and the specified surface quality. .
Rotary table speed 0,05 - 30 rpm
Grinding Wheel diameter 400 mm
Fine down feed 0,1 - 50 mm / min
Precision TTV 1 m Ra 0,06 - 0,6 m
Space (LxWxH) 2800 x 1660 mm



G & n mps t-500 backside wafer grinder G & n mps t-500 backside wafer grinder G & n mps t-500 backside wafer grinder G & n mps t-500 backside wafer grinder G & n mps t-500 backside wafer grinder G & n mps t-500 backside wafer grinder G & n mps t-500 backside wafer grinder G & n mps t-500 backside wafer grinder G & n mps t-500 backside wafer grinder G & n mps t-500 backside wafer grinder