Tristate Machinery Dismantlers Forum > ILLINOIS
> Electrical Components
> New
> Actual Warranty
> Disco diamond wafer dicing cut-off wheel/blade zbt-1730
Disco diamond wafer dicing cut-off wheel/blade zbt-1730
Disco Diamond Wafer Dicing Cut-Off Wheel/Blade ZBT-1730
NBC-ZH/ZHT/ZBT series provides high productivity and excellent process results thanks to its superb cutting ability and long life.
The NBC-ZH/ZHT/ZBT series is produced using DISCO's original technology. A combination of an ultra-thin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. In combination with DISCO's vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs.
- 10 x Disco Diamond Cut-Off Wheels ZBT-1730 Size 73.2mm x 0.1mm x 40mm
