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> Achi ir-900III dark infrared bga xbox rework station
Achi ir-900III dark infrared bga xbox rework station
ACHI IR-3 Dark Infrared BGA Rework is the latest basic products of our company, which has been improved much in the ease-of-use and other aspects on the basis of the IR-900II. It has following characteristics:
The ACHI IR-900III a duplex IR heating BGA rework station It can be afforded to weld, remove and rework the applications with different packages and mutil-level base board such as BGA PBGA CSP and make lead-free welding. The target of this product is BGA packages (including north and south bridges Chipsets) of the main boards and video cards of notebooks, desktops, XBOX, switches and so on. Its features contains as follow:
1. Duplex IR heating system. Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep solder effect, heating board is independent controlled , in contrast with Hot Air Heating, the process of heating is more stable. More, there is no nozzles required and can help you save the costs.
2. Independent heating for the top and bottom sides, also Independent heating up for the both sides. In this way, it is easier to control. Also, Over and Under Heat Alarm.
3. We have taken full consideration to the situation of small workshops and cut down the costs as possible while this product can realize the main functionalities (BGA manual welding, lead-free soldering) of the advanced rework system.
4. The station is parted designed, with high quality, and can be handled conveniently.
5. In addition, we have prepared an introduction for you, and the supplementary instruments in it are common. By the guide of the introduction, you can master the skills even you know nothing of BGA manual welding.
double-sided dark infrared heating
Independent fixture, 450mm 300mm 160 mm
Vary with the differen need of the users
About 15 kg, vary with the differen need of the users
Dark infrared heating components
Size of top heating components
Power of top heating components
Types of bottom heating components
Size of bottom heating components
Power of lower heating components
Iindependent temperature control, high-precision closed-loop control, instrumentation error 0.5%,alarm
Highly Sensitive K-temperature sensor, direct temperature monitoring
independent temperature control, high-precision closed-loop control, instrumentation error of 0.5%, no alarm
Highly Sensitive K-temperature sensor, indirect temperature monitoring
Suit for welding,remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates and lead-free welding
1.Laser spotlights assisted positioning. 2.220 V top and bottom cooling fan .
